What are the practical and fundamental limits to the evolution of the technology of modern MOS devices and interconnects? How are modern devices and circuits fabricated and what future changes are likely? Advanced techniques and models of MOS devices and back-end (interconnect and contact) processing. What are future device structures and materials to maintain progress in integrated electronics? MOS front-end and back-end process integration.
3 units · Letter or Credit/No Credit
What are the practical and fundamental limits to the evolution of the technology of modern MOS devices and interconnects? How are modern devices and circuits fabricated and what future changes are likely? Advanced techniques and models of MOS devices and back-end (interconnect and contact) processing. What are future device structures and materials to maintain progress in integrated electronics? MOS front-end and back-end process integration.
Offered in Spring 2027 at Stanford University.